MediaTek introduced its Helio X and P series SoCs for high-end smartphones back in March and officially unveiled its Helio X20 deca (10) core SoC in May. Now details about the company’s upcoming Helio X30 SoC has surfaced in China (Via).
We already know that the Helio X30 is based on 20nm process and has 2 x Cortex-A72 CPUs at 2.5GHz, 4 x Cortex-A53 CPUs at 2.0GHz and 4 x Cortex-A53 CPUs at 1.4GHz, but the Helio X30 will be based on 16nm FinFET process, and use 4 x Cortex-A72 CPUs at 2.5GHz , 2 x Cortex-A72 CPUs at 2GHz, 2 x Cortex-A53 CPUs at 1.0GHz and 2 x Cortex-A53 CPUs at 1.5GHz.
It will use ARM Mali-T880 GPU and come with 2x LPDDR4 POP 1600MHz up to 4GB RAM compared to 2x LPDDR3 POP 933MHz up to 4GB RAM on the Helio X20. It also supports better ISO support that includes 40MP 24fps / 16MP 60 fps / 8MP 120 fps, compared to 32MP 24fps / 25MP 30 fps on the Helio X20.
The leak also reveals that MediaTek is working on the Helio X22 10-core SoC with the same configuration and 20nm process, but the clock speed will be higher. No details about the individual clock speed yet. MediaTek already announced that the Helio X20 SoC will ship to OEMs in Q3 2015. The Helio X30 is not expected until early 2016.